July 14, 2026

Switzerland based Kandou AI opens India chip design headquarters in Hyderabad

Hyderabad, July 10 (TNT): Fabless semiconductor company Kandou AI on Friday opened its India Chip Design Headquarters in Hyderabad, expanding its global engineering footprint and strengthening the city’s position as a semiconductor design hub.

Located at Krishe Emerald in Kondapur, the new facility will serve as the company’s engineering centre for advanced semiconductor design, high-speed connectivity and next-generation AI infrastructure technologies.

The headquarters will house teams engaged in chip design, verification, validation, firmware, software, systems engineering and customer support, catering to the company’s global operations, Switzerland based company said in a release here.

The facility was inaugurated by BRS Working President and former Telangana IT Minister K.T. Rama Rao (KTR) in the presence of Kandou AI Chief Executive Officer and Co-founder Srujan Linga, industry representatives, customers, partners and government officials.

Addressing the gathering, Srujan Linga said Hyderabad had emerged as one of the world’s premier destinations for semiconductor engineering talent and that the company was committed to building world-class semiconductor and AI technologies from the city.

He said the company would also collaborate with universities, industry and government to nurture semiconductor talent and contribute to the growth of Hyderabad’s semiconductor ecosystem.

KTR said Kandou AI’s decision to establish its India headquarters in Hyderabad reflected the city’s emergence as a globally recognised centre for semiconductors and deep technology.

He said the investment would promote innovation, generate high-value employment and further strengthen Telangana’s semiconductor ecosystem.

Kandou AI said the Hyderabad centre would play a key role in developing advanced semiconductor and AI infrastructure technologies for customers worldwide.

Headquartered in Saint-Sulpice, Switzerland, Kandou AI develops high-speed, low-power connectivity solutions for data centres, artificial intelligence and consumer electronics.

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