HCLTech, Japan’s Rapidus join hands for next-generation semiconductor technologies
The centres will support Rapidus’ semiconductor engineering requirements, including mask design, design infrastructure, process design kit development, design technology co-optimisation and layout design, the companies said in a joint announcement on Monday.
The partnership will also focus on developing a pipeline of Indian engineering talent to meet Rapidus’ evolving requirements in Japan, strengthening technical collaboration between the two countries.
Rapidus CEO Atsuyoshi Koike said the collaboration would provide access to India’s growing pool of semiconductor engineering talent and establish dedicated development capabilities complementing the company’s operations in Japan.
HCLTech CEO and Managing Director C. Vijayakumar said the partnership brought together Rapidus’ next-generation semiconductor ambitions and HCLTech’s engineering expertise to accelerate chip adoption, reduce time-to-market and support semiconductor innovation.
Rapidus is developing and manufacturing advanced logic semiconductors in Japan, while HCLTech will contribute engineering expertise and talent development capabilities to support the Japanese company’s technology requirements.
TNT KS
